Datapaq Oven Tracker Systems

Datapaq Oven Tracker Systems

The Datapaq Oven Tracker Systems from Fluke Process Instruments are designed to provide comprehensive thermal profiles for applications such as powder coating, paint curing, component supply and general paint, powder and e-coat OEM applications up to 400°C.

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Datapaq® Oven Tracker® XL2 Temperature Profiling System

This premium oven thermal profiling system provides the most comprehensive solution in automotive assembly, component supply and general paint/powder/E-coat OEM. With a choice of standard or specialized thermal barriers and powerful Insight™ analysis software, Oven Tracker® XL2 facilitates control & optimization of your cure process.
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Datapaq EasyTrack3 Thermal Profiling System

Easy to use, accurate and reliable, the EasyTrack®3 system is designed for the day-to day needs powder coating application demands. Available in a variety of system configurations with thermal barrier, software and thermocouple options, it suits every paint/powder coater and supplier.
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Datapaq® AutoPaq® ATEX System

The Datapaq® AutoPaq® ATEX System is an intrinsically safe thermal profiling system for temperature monitoring of paint, adhesive and sealant cure processes used in the automotive assembly market.
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Datapaq® MonoPaq® Thermal Profiling System

The Datapaq MonoPaq is a customized oven profiling system designed specifically for monitoring the coating cure process of aluminum bottles, aerosols and collapsible tubes in Monoblock ovens. This system is based on the unique, smaller micro Q18 data logger and now allows both Monoblock OBO pin lines and IBO basket lines to be monitored.
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Datapaq® WicketPaq® Thermal Profiling System

The Datapaq WicketPaq is designed specifically for temperature monitoring of metal sheet and environmental temperatures in the manufacture of three piece cans in the wicket oven.
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Datapaq® RotoPaq® Thermal Profiling System

The Datapaq RotoPaq systems are designed specifically for use in rotomolding applications in domestic and commercial plastic products manufacturing. They can be used throughout the heating, as well as cooling cycles of the rotomolding process to monitor live process temperature data.
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Datapaq® Thermal Profiling System for Physical Vapor Deposition

With the Datapaq Physical Vapor Deposition (PVD) Thermal Profiling System, you can adjust and monitor your thermal profile in the oven cycle of the PVD process and obtain the precise temperatures of the product required to achieve an extremely durable and smooth product finish.